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[PS-3-03] Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF₄ Plasma Treatment

^○P. Gomasang¹, K. Ueno^1,2 (1.Shibaura Inst. of Tech. (Japan), 2.SIT Res. Center for Green Innov. (Japan))

https://doi.org/10.7567/SSDM.2019.PS-3-03