16:30 〜 16:45

[C-2-03] 3D Packaging and Integration Technology using Photosensitive Mold

〇Kentaro Mori¹, Soichi Yamashita¹, Masahiro Sekiguchi¹ (1. Toshiba Electronic Devices & Storage Corp.(Japan))

https://doi.org/10.7567/SSDM.2020.C-2-03