16:36 〜 16:43

[D-2-05] Experimental Validation of Thermal Couple Impedance Model for Accurate Die Temperature Estimation in Power Modules

〇Yohei Nakamura^1,3、Naotaka Kuroda¹、Ken Nakahara¹、Michihiro Shintani²、Takashi Sato³ (1.ROHM Co., Ltd.、2.Graduate School of Sci. and Tech., Nara Inst. of Sci. and Tech.、3.Graduate School of Informatics, Kyoto Univ.)

https://doi.org/10.7567/SSDM.2021.D-2-05