16:29 〜 16:36

[L-2-04] A bonding-less 5-GHz RFID module using a 300um x 500um IC chip

〇Reiji Miura¹、Saito Shibata¹、Masahiro Usui¹、Kota Shiba¹、Atsutake Kosuge¹、Mototsugu Hamada¹、Tadahiro Kuroda¹ (1.Univ. of Tokyo)

https://doi.org/10.7567/SSDM.2021.L-2-04