Evaluation of the WO<sub>x</sub> Film Properties for ReRAM Application

Y. Y. Chen; W. C. Chien; M. H. Lee; Y. C. Chen; A. T. H. Chuang; T. J. Hong; S. J. Lin; T. B. Wu; C. Y. Lu

doi:https://doi.org/10.7567/SSDM.2011.P-4-7

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[P-4-7] Evaluation of the WO_x Film Properties for ReRAM Application

Y. Y. Chen^1,2, W. C. Chien², M. H. Lee², Y. C. Chen², A. T. H. Chuang², T. J. Hong¹, S. J. Lin¹, T. B. Wu¹, C. Y. Lu² (1.National Tsing Hua Univ., 2.Macronix Int'l Corp., Ltd. , Taiwan)

https://doi.org/10.7567/SSDM.2011.P-4-7

▲

2011 International Conference on Solid State Devices and Materials

[P-4-7] Evaluation of the WOx Film Properties for ReRAM Application

[P-4-7] Evaluation of the WO_x Film Properties for ReRAM Application