[FriAM1D] (Special Session) Protection performance and components technology against HEMP, HPEM and IEMI

[FriAM1D.3] A Numerical Analysis on Electro-Magnetic Coupling of Printed Circuit Board and High-Frequency Radiated Field

^○Soki Akutsu(Mitsubishi Heavy Industries, Ltd.), Akio Ikeda(Mitsubishi Heavy Industries Ltd), Hisashi Shimizu(Mitsubishi Heavy Industries Ltd.), Toshihiko Nishimori(Mitsubishi Heavy Industries Ltd.), Jun Yasui(Mitsubishi Heavy Industries Ltd.)