[TuePM1A] (Regular Session) Signal and Power Integrity (1)

[TuePM1A.2] Mitigating Crosstalk in High-Speed Digital Interconnect Systems Using High-Impedance Surface With Embedded Metal Protrusions

^○Bing-Jia Zhong(National Taiwan University of Science and Technology), Cheng-Yi Zhuang(National Taiwan University of Science and Technology), Ding-Bing Lin(National Taiwan University of Science and Technology), Nick Huang(Hewlett Packard Enterprise)