Oral Sessions
Laser Material Processing
Tue. Sep 5, 2023 3:00 PM - 5:00 PM Lavender I (3F)
Chair: Daniela Serien (AIST, Japan)
3:00 PM - 3:30 PM
*Sung-Hak CHO1 (1. KIMM (Korea Institute of Machinery & Materials))
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3:30 PM - 3:45 PM
Han Yi Tan1, Guang Liang Ong1, Chen Hon Nee1, Teck Yong Tou1, Seong Ling Yap2, *Seong Shan Yap3 (1. Faculty of Engineering, Multimedia University, Malaysia., 2. Plasma Technology Research Centre, Department of Physics, Faculty of Science, University of Malaya, Kuala Lumpur, Malaysia., 3. Department of Physics, Xiamen University Malaysia.)
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3:45 PM - 4:15 PM
*THANH HUNG DINH1, Masahiko Ishino1, Noboru Hasegawa1, Yoshiteru Yonetani1, Matayasu Hata1, Masaharu Nishikino1 (1. National Institutes for Quantum Science and Technology, Kansai Photon Science Institute)
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4:15 PM - 4:30 PM
*Ren Aoki1, Keita Katayama1, Daisuke Nakamura1, Hisato Yabuta1, Hiroshi Ikenoue1, Taizoh Sadoh1 (1. Kyushu University)
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4:30 PM - 4:45 PM
*Ryuma Takabatake1, Toshifumi Kikuchi1, Keita Katayama1, Mitsuhiro Higashihata 1, Daisuke Nakamura1, Hiroshi Ikenoue1 (1. Kyushu University)
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4:45 PM - 5:00 PM
*Shumpei Fujio1, Mao Sudo1, Yuji Sato2, Keisuke Takenaka2, Masahiro Tsukamoto2 (1. Graduate School of Engineering, Osaka University, 2. Joining and Welding Research Institute, Osaka University)
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