OS2-2

[OS2-2-03] Bottom-up exploration of interaction parameters in reactive DPD simulation for epoxy polymers

*Kaiwen Li¹, Gota Kikugawa², Yoshiaki Kawagoe³, Yinbo Zhao⁴, Tomonaga Okabe⁵ (1. Tohoku University, 2. Tohoku University, 3. Tohoku University, 4. Tohoku University, 5. Tohoku University)

キーワード：Epoxy resin, Curing process, DPD simulation method, Interaction parameters, Structural properties