Materials Chemistry

[1PB-113] Development of technology for forming fine copper wiring in the air on polyimide substrates using laser irradiation and glyoxylic copper complex

03.Poster

○TAKAHASHI, Naoki; OHISHI, Tomoji (Grad. Sch. Eng. Sci., Shibaura Inst. of Tech.)

Keywords:printed electronics、copper wiring、copper plating、polyimide film、laser