2018 The Chemical Society of Japan

Presentation information

Advanced Technology Program (ATP) [Poster]

New materials

New materials

Tue. Mar 20, 2018 3:00 PM - 4:30 PM P (Arena, Sports Hall)

[1PC-085] Copper particle pastes for low temperature and rapid sintering process

04.ATP Poster

○YONEZAWA, Tetsu; TSUKAMOTO, Hiroki (Grad. Sch. Eng., Hokkaido Univ.)

Keywords:copper、electro conductive、pastes、sintering