2018 The Chemical Society of Japan

Presentation information

Academic Program (AP)

Colloid and Interface Chemistry

Colloid and Interface Chemistry

Thu. Mar 22, 2018 9:00 AM - 12:10 PM E5 (1023, Bldg. 10)

3E5-01~3E5-06 KAJITANI, Takashi
3E5-08~3E5-12 ISODA, Kyosuke
3E5-15~3E5-19 YONEZAWA, Tetsu

AM

10:10 AM - 10:30 AM

[3E5-08] Dispersions of copper particles for low temperature and rapid sintering to prepare conductive copper layers

02.Oral B

○YONEZAWA, Tetsu; TSUKAMOTO, Hiroki (Grad. Sch. Eng., Hokkaido Univ.)

PC Setting Time : 10:00 - 10:10

Keywords:copper、electroconductive、pastes、particle sizes、sintering