Effect of Small Amount of Metal Chlorides Addition on Aluminum Electrodeposited Film Plated from Bath using Non-Aqueous Solvent

Presentation information

Academic Program (AP) [Poster]

Inorganic Chemistry

Sat. Mar 16, 2019 10:00 AM - 11:30 AM P (Arena, Gymnasium and Auditorium [1F])

Presentation time：Odd Poster Number 10:00-10:45 / Even Poster Number 10:45-11:30

○OGATA, Ryo; YANAI, Kouhei; KOIWA, Ichirou (Graduate School of Engineering)

Keywords:Nonaqueous Solvent、Dimethylsulfone、Shiny surface、Aluminum Electrodeposition、Addition of Metal Chloride

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