Development of copper fine wiring formation technology on polyimide film in the atmosphere by laser irradiation and micro-contact-printing using of glyoxylic acid copper complex

Presentation information

Academic Program (AP) [Poster]

Applications of Materials

Sat. Mar 16, 2019 12:30 PM - 2:00 PM P (Arena, Gymnasium and Auditorium [1F])

Presentation time：Odd Poster Number 12:30-13:15 / Even Poster Number 13:15-14:00

○UETSUKI, Akira; OHISHI, Tomoji (Grad. Sch. Eng. Sci., Shibaura Inst. of Tech.)

Keywords:Copper complex、Micro contact printing、Atmospheric treatment、Flexible film、Electroless copper plating

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