D. Cheng ¹, Y. Wang ¹, C. Xu ¹, L. Gu ¹, H. Chen ¹, ^○Z. Feng ¹ (1.Beijing Inst. of Tech. (China))

^○V. Sergan ¹, T. Sergan ¹, P.J. Bos ² (1.California State Univ. , Sacramento (USA), 2.Kent State Univ. (USA))

C.-H. Tien ¹, S.-L. Ou ², ^○D.-S. Wuu ¹ (1.Natl. Chung Hsing Univ. (Taiwan), 2.Da-Yeh Univ. (Taiwan))

^○D.B. To ^1,4, C.H. Chen ², Y.W. Yeh ², R.J. Ho ³, C.H. Kan ¹, C.C. Hsu ¹ (1.National Chung Cheng Univ. (Taiwan), 2.Industrial Technology Research Institute (Taiwan), 3.National Central Univ. (Taiwan), 4.Advanced Institute of Manufacturing with High-tech Innovations (Taiwan))

^○D. Gloess ¹, H. Bartzsch ¹, T. Goschurny ¹, A. Drescher ¹, U. Hartung ¹, P. Frach ¹ (1.Fraunhofer Inst. for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany))