[B-2-1] Grinding Force Distributions and Wear Behaviors of Grain Cutting Edges in Deep Grinding using Seeded Gel Abrasive Grinding Wheel

〇Masakazu Fujimoto¹, Keisuke Shimizu² (1.Kindai University, 2.Aoyama Gakuin University)

[B-2-2] Trial Production of Recycled-Grinding Wheel for Wet Polishing using Spent Grinding Wheel

〇Takeshi Hamada¹, Akira Mizobuchi¹, Atsuyoshi Tashima², Keita Horimoto¹, Tohru Ishida¹ (1.Tokushima University, 2.Ishihara Kinzoku Co., Ltd)

[B-2-4] Investigation of Crystallographic Aspects of Subsurface Damage Induced by Grinding Using Micro Raman Tomographic Imaging

〇Teppei Onuki¹, Shunsuke Kan¹, Wanpiao Lin¹, Wentong Lu¹, Kousuke Hasegawa¹, Hirotaka Ojima¹, Jun Shimizu¹, Libo Zhou¹ (1.Ibaraki University)

[B-2-5] Grinding CFRP with Cold Air Supply from inside of Thin Walled Electrodeposited Grinding Wheel

〇Yoshiyuki Kita¹, Yukio Ito¹, Hiroyuki Sasahara¹ (1.Tokyo University of Agriculture and Technology)

[B-2-6] Improvement of Form Accuracy of Slender Workpiece in Cylindrical Traverse Grinding with Steady Rest

〇Hidetaka Fujii¹, Takashi Onishi¹, Chinhu Lin², Moriaki Sakakura³, Kazuhito Ohashi¹ (1.Okayama University, 2.YAMAMOTO METAL TECHNOS CO., LTD., 3.Daido University)

[B-2-7] Effect of a coolant supply assist sheet included in a woven metal wire tool with electrodeposited diamond grains on CFRP core drilling

〇Masahiro Kawabata¹, Mamoru Nomura², Yukio Ito¹, Hiroyuki Sasahara¹ (1.Tokyo University of Agriculture and Technology, 2.IBARAKI GRINDING WHEEL Co., Ltd.)

[B-2-8] An Effect of a Setting Depth of Cut in a Face Grinding Process with a Single Layer Electro Plated Diamond Grinding Wheel with Periphery R Shape

〇Takanori Fujiwara¹, Koudai Hiramatsu³, Takuro Hashiguchi⁴, Takashi Tsujino², Ryo Komatsubara¹, Takashi Onishi¹, Hiroyuki Kodama¹, Kazuhito Ohashi¹ (1.Okayama University, 2.TOYOTA MOTOR Corp., 3.Panasonic Corp.,, 4.Kobe Steel,Ltd.,)

[B-2-9] Accurate Estimation of Workpiece Dimension in Plunge Grinding without Sizing Gauge

〇Takashi Onishi¹, Yuki Murata¹, Kohei Fujiwara¹, Moriaki Sakakura², Kazuhito Ohashi¹ (1.Okayama University, 2.Daido University)

Session information

B-2 Advanced grinding technologies