[B-2-1] Grinding Force Distributions and Wear Behaviors of Grain Cutting Edges in Deep Grinding using Seeded Gel Abrasive Grinding Wheel

〇Masakazu Fujimoto¹、Keisuke Shimizu² (1.Kindai University、2.Aoyama Gakuin University)

[B-2-2] Trial Production of Recycled-Grinding Wheel for Wet Polishing using Spent Grinding Wheel

〇Takeshi Hamada¹、Akira Mizobuchi¹、Atsuyoshi Tashima²、Keita Horimoto¹、Tohru Ishida¹ (1.Tokushima University、2.Ishihara Kinzoku Co., Ltd)

[B-2-4] Investigation of Crystallographic Aspects of Subsurface Damage Induced by Grinding Using Micro Raman Tomographic Imaging

〇Teppei Onuki¹、Shunsuke Kan¹、Wanpiao Lin¹、Wentong Lu¹、Kousuke Hasegawa¹、Hirotaka Ojima¹、Jun Shimizu¹、Libo Zhou¹ (1.Ibaraki University)

[B-2-5] Grinding CFRP with Cold Air Supply from inside of Thin Walled Electrodeposited Grinding Wheel

〇Yoshiyuki Kita¹、Yukio Ito¹、Hiroyuki Sasahara¹ (1.Tokyo University of Agriculture and Technology)

[B-2-6] Improvement of Form Accuracy of Slender Workpiece in Cylindrical Traverse Grinding with Steady Rest

〇Hidetaka Fujii¹、Takashi Onishi¹、Chinhu Lin²、Moriaki Sakakura³、Kazuhito Ohashi¹ (1.Okayama University、2.YAMAMOTO METAL TECHNOS CO., LTD.、3.Daido University)

[B-2-7] Effect of a coolant supply assist sheet included in a woven metal wire tool with electrodeposited diamond grains on CFRP core drilling

〇Masahiro Kawabata¹、Mamoru Nomura²、Yukio Ito¹、Hiroyuki Sasahara¹ (1.Tokyo University of Agriculture and Technology、2.IBARAKI GRINDING WHEEL Co., Ltd.)

[B-2-8] An Effect of a Setting Depth of Cut in a Face Grinding Process with a Single Layer Electro Plated Diamond Grinding Wheel with Periphery R Shape

〇Takanori Fujiwara¹、Koudai Hiramatsu³、Takuro Hashiguchi⁴、Takashi Tsujino²、Ryo Komatsubara¹、Takashi Onishi¹、Hiroyuki Kodama¹、Kazuhito Ohashi¹ (1.Okayama University、2.TOYOTA MOTOR Corp.、3.Panasonic Corp.,、4.Kobe Steel,Ltd.,)

[B-2-9] Accurate Estimation of Workpiece Dimension in Plunge Grinding without Sizing Gauge

〇Takashi Onishi¹、Yuki Murata¹、Kohei Fujiwara¹、Moriaki Sakakura²、Kazuhito Ohashi¹ (1.Okayama University、2.Daido University)

セッション情報

B-2 Advanced grinding technologies