B-5 Non-traditional machinings and additive manufacturings

[B-5-9] Development of a dicing process for 4H-SiC wafers by Plasma Chemical Vaporization Machining (PCVM) using a metal slit mask

〇Yuma Nakanishi¹, Risa Mukai¹, Satoshi Matsuyama¹, Kazuto Yamauchi¹, Yasuhisa Sano¹ (1.Osaka University)

Keywords:Processing、dicing、plasma etching