[B-5-9] Development of a dicing process for 4H-SiC wafers by Plasma Chemical Vaporization Machining (PCVM) using a metal slit mask 〇Yuma Nakanishi1、Risa Mukai1、Satoshi Matsuyama1、Kazuto Yamauchi1、Yasuhisa Sano1 (1.Osaka University) キーワード:Processing、dicing、plasma etching