The 39th International Conference of Photopolymer Science and Technology

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Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 9:00 AM - 10:40 AM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

9:30 AM - 9:50 AM

[3A1002] Patterning Strategies for High Density Packages for Diverse Applications [Invited]

*Sanjay Malik1 (1. FUJIFILM ELECTRONIC MATERIALS U.S.A., Inc.)