The 39th International Conference of Photopolymer Science and Technology

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Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 9:00 AM - 10:40 AM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

9:50 AM - 10:10 AM

[3A1003] Novel temporary bonding/debonding system enabling advanced packaging process

*Tetsuya Enomoto1, Emi Miyazawa1, Yuta Akasu1, Takashi Kawamori1, Yuki Nakamura2, Shogo Sobue2 (1. Showa Denko Materials Co.,Ltd. Research & Innovation Promotion Headquarters, 2. Showa Denko Materials Co.,Ltd. Information & Communication Business Headquaters)