The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 09:00 〜 10:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

09:50 〜 10:10

[3A1003] Novel temporary bonding/debonding system enabling advanced packaging process

*Tetsuya Enomoto1, Emi Miyazawa1, Yuta Akasu1, Takashi Kawamori1, Yuki Nakamura2, Shogo Sobue2 (1. Showa Denko Materials Co.,Ltd. Research & Innovation Promotion Headquarters, 2. Showa Denko Materials Co.,Ltd. Information & Communication Business Headquaters)