The 39th International Conference of Photopolymer Science and Technology

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Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 9:00 AM - 10:40 AM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

10:10 AM - 10:30 AM

[3A1004] Characterization of Polyimide based Photoimageable Dielectric Materials for Adhesive Bonding by Surface Modification and Chemical Mechanical Polishing

*Raj Sakamuri1, Michaela Connell1, Stephanie Dilocker1, Eric Turner1, Sanjay Malik1 (1. Fujifilm Electronic Materials Inc)