The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 09:00 〜 10:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

10:10 〜 10:30

[3A1004] Characterization of Polyimide based Photoimageable Dielectric Materials for Adhesive Bonding by Surface Modification and Chemical Mechanical Polishing

*Raj Sakamuri1, Michaela Connell1, Stephanie Dilocker1, Eric Turner1, Sanjay Malik1 (1. Fujifilm Electronic Materials Inc)