8:45 AM - 9:15 AM
*Christoph Marczok1, E. Hoene1 (1. Fraunhofer IZM(Germany))
Oral Presentation
Packaging and Applications
Tue. Oct 1, 2019 8:45 AM - 10:15 AM Room A (Kyoto International Conference Center)
8:45 AM - 9:15 AM
*Christoph Marczok1, E. Hoene1 (1. Fraunhofer IZM(Germany))
9:15 AM - 9:30 AM
*Wei Fan1, Garry Wexler2, Emre Gurpinar3, Burak Ozpineci3 (1. Momentive Performance Materials Inc.(United States of America), 2. Henkel Corp.(United States of America), 3. Oak Ridge National Laboratory(United States of America))
9:30 AM - 9:45 AM
*Hiroyuki MATSUSHIMA1, Yuki MORI1, Akio SHIMA1 (1. Hitachi, Ltd. Research & development Group(Japan))
9:45 AM - 10:00 AM
*Felix Hoffmann1, Nando Kaminski1 (1. University of Bremen(Germany))
10:00 AM - 10:15 AM
*Elena Mengotti1, Enea Bianda1, David Baumann1, Jason Bettega1, Joni Jormanainen2 (1. ABB(Switzerland), 2. ABB Drives(Finland))
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