8:45 AM - 9:15 AM
*Zhong Chen1, A Mantooth1 (1. Department of Electrical Engineering, University of Arkansas(United States of America))
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Schedule
Session information
Oral Presentation
Packaging and Applications
[We-1B] High Temperature and IC
Wed. Oct 2, 2019 8:45 AM - 10:15 AM Annex Hall 2 (Kyoto International Conference Center)
9:15 AM - 9:30 AM
*Matthaeus Albrecht1, David Pérez1, Roric C. Martens1, Anton J. Bauer2, Tobias Erlbacher2 (1. Friedrich-Alexander-Univ. Erlangen-Nürnberg(Germany), 2. Fraunhofer IISB(Germany))
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Schedule
9:30 AM - 9:45 AM
*David J Spry1, Philip G Neudeck1, Carl W Chang2 (1. NASA(United States of America), 2. Vantage Partners LLC(United States of America))
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Schedule
9:45 AM - 10:00 AM
*Julietta Weisse1, Christian Matthus2, Heinz Mitlehner2, Tobias Erlbacher2 (1. Friedrich-Alexander-University Erlangen-Nuremberg(Germany), 2. Fraunhofer Institute of Integrated Systems and Device Technology(Germany))
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Schedule
10:00 AM - 10:15 AM
*Francesco La Via1, Salvatore Tudisco2, Clementina Agodi2, Francesco Cappuzzello2,5, Antonello Santangelo3, Massimo Zimbone1, Marco Mauceri4 (1. CNR-IMM(Italy), 2. INFN-LNS(Italy), 3. STMicroelectronics(Italy), 4. LPE(Italy), 5. Physics Department, University of Catania(Italy))
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Schedule