08:45 〜 09:15
Daniel J Lichtenwalner1, Shadi Sabri1, Edward Van Brunt1, Brett Hull1, Sei-Hyung Ryu1, Jae-Hyung Park1, Satyaki Ganguly1, *Donald A. Gajewski1, Scott Allen1, John W. Palmour1 (1. Wolfspeed, a Cree Company(United States of America))
Oral Presentation
Packaging and Applications
2019年10月3日(木) 08:45 〜 10:15 Room A (Kyoto International Conference Center)
08:45 〜 09:15
Daniel J Lichtenwalner1, Shadi Sabri1, Edward Van Brunt1, Brett Hull1, Sei-Hyung Ryu1, Jae-Hyung Park1, Satyaki Ganguly1, *Donald A. Gajewski1, Scott Allen1, John W. Palmour1 (1. Wolfspeed, a Cree Company(United States of America))
09:15 〜 09:30
*Alberto Castellazzi1, Alessandro Borghese3, Francois Boige2, Vanessa Chazal4 (1. University of Nottingham(UK), 2. LAPLACE - University of Toulouse(France), 3. University of Naples "Federico II"(Italy), 4. THALES(France))
09:30 〜 09:45
*Jiaxing Wei1, Siyang Liu1, Sheng Li1, Lizhi Tang1, Rongcheng Lou1, Hao Fu1, Hangbo Zhao1, Weifeng Sun1, Xiaobing Zhang2, Song Bai3 (1. National ASIC System Eng. Res. Center, School of Electronics Sci. and Eng., Southeast Univ.(China), 2. School of Electronics Sci. and Eng., Southeast Univ.(China), 3. State Key Lab. of Wide-bandgap Semiconductor Power Electronic Devices, Nanjing Electronic Device Inst.(China))
09:45 〜 10:00
*Arthur Witulski1, Robert A. Johnson1, Scooter R. Ball1, Michael L. Alles1, Robert A. Reed1, Ronald D. Schrimpf1, John M. Hutson3, Arto Javanainen, Jean-Marie Lauenstein2 (1. Vanderbilt Univ.(United States of America), 2. National Institute of Aeronautics and Aerospace(United States of America), 3. Lipscomb Univ. (United States of America))
10:00 〜 10:15
*Yaren Huang1, Benedikt Lechner1, Gerhard Wachutka1 (1. Technical Univ. of Munich(Germany))
要旨・抄録、PDFの閲覧には参加者用アカウントでのログインが必要です。参加者ログイン後に閲覧・ダウンロードできます。
» 参加者用ログイン