Schedule 12 12:00 PM - 12:15 PM [Mo-1A-02] Effects of Grounding Bottom Oxide Protection Layer in Trench-Gate SiC-MOSFET by Tilted Al Implantation *Yutaka Fukui1, Katsutoshi Sugawara1, Rina Tanaka1, Hidenori Koketsu1, Hideyuki Hatta1, Yusuke Miyata1, Hiroyoshi Suzuki1, Kensuke Taguchi1, Yasuhiro Kagawa1, Shingo Tomohisa1, Naruhisa Miura1 (1. Mitsubishi Electric Corp.(Japan))