[Tu-1A] Packaging

[Tu-1A-02] Improving Heat Conduction of Insulated Metal Substrate with Thermal Pyrolytic Graphite Core for SiC Power Module Packaging

*Wei Fan¹, Garry Wexler², Emre Gurpinar³, Burak Ozpineci³ (1. Momentive Performance Materials Inc.(United States of America), 2. Henkel Corp.(United States of America), 3. Oak Ridge National Laboratory(United States of America))