*Minwho Lim1, Tomasz Sledziewski1, Mathias Rommel1, Tobias Erlbacher1, Hongki Kim2, Seongjun Kim2, Hoon-Kyu Shin2, Anton Bauer1
(1. Fraunhofer Inst. for Integrated Systems and Device Technology IISB(Germany), 2. Pohang Uni. of Science and Technology POSTECH(Korea))