*LI ZHENG1, Qian Wang1, Xinhong Cheng1,2, Shaoyu Liu1, Dawei Xu1, Lingyan Shen1, Tomasz Sledziewski3, Tobias Erlbacher3, Yuehui Yu1,2
(1. Shanghai Inst. of Microsystem and Info. Tech., Chinese Academy of Sciences(China), 2. Center of Materials Sci. and Optoelectronics Engineering, Univ. of Chinese Academy of Sciences(China), 3. Fraunhofer Inst. for Integrated Systems and Device Technology(Germany))