ICSCRM2019

Presentation information

Oral Presentation

Packaging and Applications

[We-1B] High Temperature and IC

Wed. Oct 2, 2019 8:45 AM - 10:15 AM Annex Hall 2 (Kyoto International Conference Center)

8:45 AM - 9:15 AM

[We-1B-01(Invited)] High Temperature Gate Driving Technology with Galvanic Isolation for Integrated SiC Power Modules

*Zhong Chen1, A Mantooth1 (1. Department of Electrical Engineering, University of Arkansas(United States of America))