5:00 PM - 5:05 PM
Session information
Oral Presentation
[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics
Wed. Nov 27, 2019 5:00 PM - 6:30 PM Room 108 (1F)
Chair: Toshihide Kamata (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Makoto Arai (ULVAC Inc.)
5:05 PM - 5:30 PM
*Masato Ohsawa1, Natsuki Hashimoto1, Naoki Takeda2, Shota Tsuneyasu2, Toshifumi Satoh2 (1. ULVAC, Inc. (Japan), 2. Tokyo Polytechnic University (Japan))
5:30 PM - 5:50 PM
*Chiharu Kura1, Mototaka Ochi1, Hiroyuki Okuno2, Hiroshi Goto2 (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))
5:50 PM - 6:05 PM
*John Fahlteich1, Michiel Top1, Stefan Hinze1, Uwe Meyer1, Tobias Vogt1, Valentijn von Morgen2, Matthias Fahland1 (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))
6:10 PM - 6:30 PM
*Yuto Toshimori1, Sohei Nonaka1 (1. Mitsubishi Materials Corporation (Japan))