Session information

Oral Presentation

[FLX6] Advanced Process and Evaluation for Flexible Electronics

Fri. Nov 29, 2019 3:00 PM - 4:00 PM Room 204 (2F)

Chair: Tadahiro Furukawa (Yamagata University)
Co-Chair: Akira Nakazawa (AGC Inc.)

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3:00 PM - 3:25 PM

[FLX6-1(Invited)] Solution-Processing of Inorganic and Hybrid Materials for High Performance Flexible Electronics

*Myung-Gil Kim¹ (1. Sungkyunkwan University (Korea))

3:25 PM - 3:45 PM

[FLX6-2] Analysis and Design of Mechanical Stresses on Foldable Devices

*Nao Ando¹, Kei Hyodo¹, Hisao Sasaki¹, Yoshihito Ota¹, Tomoki Sasayama², Yoshihiko Iwao², Tomoya Tsuda², Nao Terasaki³ (1. YUASA SYSTEM (Japan), 2. Shimadzu Co. (Japan), 3. AIST (Japan))

3:45 PM - 4:00 PM

[FLX6-4L] To Make a Flexible Patch Type Photoelectric Pulse Wave Sensor Highly Sensitivity

*Mana Hashimoto¹, Kazuki Ihara¹, Hiroshi Kajitani¹, Hiroyuki Endo¹ (1. NEC Corporation. (Japan))

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