*Youngho Kim¹, Hak Ki Yu¹ (1. Ajou University (Korea))

*Yun taek Park¹, Sang woo Kim¹, Gui young Han¹, Sung min Cho¹ (1. University of Sungkyunkwan (Korea))

*Yali Liu¹, Yongzhen Jia², Zhengzhou Liu³, Di Wu³, Haoqun Li¹, Zhuo Zhang¹ (1. WuHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO.,LTD (China), 2. Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, 518132, China (China), 3. State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China (China))

*Ao Liu¹, Huihui Zhu¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (POSTECH) (Korea))

*Hansai Ji¹, Di Geng¹, Yuxin Gong¹, Qian Chen¹, Xinlv Duan¹, Yue Su¹, Xuewen Shi¹, Linrun Feng², Zhe Liu², Minghua Tang³, Simon Ogier⁴, Ling Li¹, Ming Liu¹ (1. Institute of microelectronics of the academy of science (China), 2. Wuhan LinkZill Technology Co., Ltd. (China), 3. Xiangtan University (China), 4. NeuDrive Limited (China))

*Tomoki Nakagaki¹, Takashi Kawabata¹, Hiroshi Takimoto², Tadahiro Furukawa³ (1. Mitsuboshi Diamond Industrial Co., Ltd. (Japan), 2. Nippon Electric Glass Co., Ltd. (Japan), 3. Yamagata University (Japan))

*Dongseob Ji¹, Jimin Kwon¹, Haksoon Jung¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (Korea))