[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

[FLX1/FMC3-2] Al alloying effect in functionalization of mechanical resistance to foldable display interconnections

*Chiharu Kura¹, Mototaka Ochi¹, Hiroyuki Okuno², Hiroshi Goto² (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))

Keywords:Al alloys, bending resistance, intermetallic compounds

For the metal interconnection in foldable displays, bending resistance is essential in addition to heat resistance and low electrical resistivity. The bending resistance of Al-Nd alloy interconnections can be controlled by precipitation of intermetallic compounds. Then, the Al alloy interconnections capable of dry-ething patterning have also been developed.