The 26th International Display Workshops (IDW '19)

講演情報

Oral Presentation

[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

2019年11月27日(水) 17:00 〜 18:30 Room 108 (1F)

Chair: Toshihide Kamata (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Makoto Arai (ULVAC Inc.)

17:30 〜 17:50

[FLX1/FMC3-2] Al alloying effect in functionalization of mechanical resistance to foldable display interconnections

*Chiharu Kura1, Mototaka Ochi1, Hiroyuki Okuno2, Hiroshi Goto2 (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))

キーワード:Al alloys, bending resistance, intermetallic compounds

For the metal interconnection in foldable displays, bending resistance is essential in addition to heat resistance and low electrical resistivity. The bending resistance of Al-Nd alloy interconnections can be controlled by precipitation of intermetallic compounds. Then, the Al alloy interconnections capable of dry-ething patterning have also been developed.