[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

[FLX1/FMC3-2] Al alloying effect in functionalization of mechanical resistance to foldable display interconnections

*Chiharu Kura¹, Mototaka Ochi¹, Hiroyuki Okuno², Hiroshi Goto² (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))

キーワード：Al alloys, bending resistance, intermetallic compounds

For the metal interconnection in foldable displays, bending resistance is essential in addition to heat resistance and low electrical resistivity. The bending resistance of Al-Nd alloy interconnections can be controlled by precipitation of intermetallic compounds. Then, the Al alloy interconnections capable of dry-ething patterning have also been developed.