[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

[FLX1/FMC3-5L] Roll-to-roll Processing of Transparent and Robust Permeation Barrier Films for Flexible Electronics

*John Fahlteich¹, Michiel Top¹, Stefan Hinze¹, Uwe Meyer¹, Tobias Vogt¹, Valentijn von Morgen², Matthias Fahland¹ (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))

Keywords:Permeation Barrier, Flexible Electronics Encapsulation, Magnetron Sputtering, PECVD, Roll-to-Roll

Water vapor permeability of permeation barrier films and thin film encapsulation coatings is determined both by intrinsic factors: material and technology selection and extrinsic factors: e.g. particle contamination or process defects. This paper discusses optimization strategies to achieve low permeability gas barrier films that are robust in roll-to-roll processing and integration to devices. Water vapor transmission rates of < 5·10^-4 g/(m²d) at 38°C / 90 % r.h. are demonstrated reproducibly in a full roll-to-roll process chain using a sputtered barrier layer and a protective top-coat.