[FLX6] Advanced Process and Evaluation for Flexible Electronics

[FLX6-2] Analysis and Design of Mechanical Stresses on Foldable Devices

*Nao Ando¹, Kei Hyodo¹, Hisao Sasaki¹, Yoshihito Ota¹, Tomoki Sasayama², Yoshihiko Iwao², Tomoya Tsuda², Nao Terasaki³ (1. YUASA SYSTEM (Japan), 2. Shimadzu Co. (Japan), 3. AIST (Japan))

Keywords:Mechanical stresses, Foldable devices, Endurance test, Mechanoluminescent material

Knowledge of mechanical stresses on foldable devices is important to develop them. When you study stresses, you should control motion profile then study dynamic strain energy. In our study, we slightly adjusted each testing conditions to figure out effect from these difference and sensitivity of the analyzing method.