[FMCp3] Metrology & Manufacturing

[FMCp3-5] Post-oven Induced Surface Hydrophobicity Degradation of CF₄ Plasma Treated Polyimide Photo Resistance

*Letao Zhang^1,2, Xiaoliang Zhou², Peng Zhang¹, Yingchun Fan¹, Qiankun Xu¹, Liangfen Zhang¹, Xiaoxing Zhang¹, Yuan Jun Hsu¹, Shengdong Zhang² (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (China), 2. Peking University (China))

キーワード：polyimide film, hydrophobicity, plasma treatment, bank, post-oven

Polyimide films were treated by CF₄ plasma to serve as bank material for inkjet printing OLED. Excellent hydrophobicity was thus obtained due to the F implantation. However, degradation of hydrophobicity was observed by post-oven, an inevitable process for inkjet printing. This degradation is probably caused by the H₂O/O₂ chemical adsorption.