5:50 PM - 6:05 PM
[FLX3-4L] Effect of Pressure Thermoforming Conditions on PC Sheet integrating Electric Wiring for 3D Electronics Technology
3D Electronics, Pressure thermoforming, Thermoformable conductive paste
As a new method for “3D Electronics”, we have investigated the effect of pressure thermoforming conditions on PC sheet integrating Electric Wiring. By evaluating sheet deformation and disconnection behavior of electric wiring, we found that long-pressing time and early pressing timing were especially significant parameters of process conditions.