ISLC2022

Session information

Oral presentation

[WC] Silicon Integration 2

Wed. Oct 19, 2022 1:45 PM - 3:10 PM International Conference Hall (3F)

Session Chairs: Di Liang(Alibaba Group US), Nobuhiko Nishiyama(Tokyo Institute of Technology)

1:45 PM - 2:10 PM

*Kaiyin Feng1, Chen Shang2, Eamonn Hughes2, Rosalyn Koscica2, Andrew Clark3, Mukul Debnath3, Gerald Leake4, David Harame4, Peter Ludewig5, John Bowers1,2 (1. Dept. of Electrical and Computer Engineering, Univ. of California, Santa Barbara (United States of America), 2. Materials Dept., Univ. of California, Santa Barbara (United States of America), 3. IQE, Inc. (United States of America), 4. RF SUNY Polytechnic Inst. (United States of America), 5. NAsP_III/V GmbH (Germany))

Presentation style: Online

2:25 PM - 2:40 PM

*FREDERIC GRILLOT1,6, Gabriel Callado1,2, Shihao Ding1, Theo Verolet3, Jean Decobert4, Christophe Jany5, Karim Hassan5, Stephane Malhouitre5, Daniel Make4, A Coquiard5, Sylvain Combrié2, Alexandre Shen4, Alfredo de Rossi2 (1. TELECOM PARIS (France), 2. Thales Research and Technolog (France), 3. Nokia (United States of America), 4. III-V Lab (France), 5. CEA LETI (France), 6. Center for High Technology Materials (United States of America))

Presentation style: Online

2:40 PM - 2:55 PM

*Qi LIN1, Jie HUANG1, Liying LIN1, Ying XUE1, Zengshan XING 2, Kam Sing WONG2, Kei May LAU1 (1. Department of Electronic and Computer Eng., Hong Kong Univ. of Sci. and Tech. (Hong Kong), 2. Department of Physics and William Mong Inst. of Nano Sci. and Tech., Hong Kong Univ. of Sci. and Tech. (Hong Kong))

Presentation style: On-site (in-person)