56 GBd High Power InP EAM Chip for Hybrid Integration

Presentation information

Oral presentation

Mon. Oct 17, 2022 8:40 AM - 10:20 AM International Conference Hall (3F)

Session Chairs: Jonathan Klamkin(UC Santa Barbara), Keita Mochizuki(Mitsubishi Electric Corporation)

9:50 AM - 10:05 AM

*Jan Gregor Gatzmann¹, Martin Moehrle¹, Ute Troppenz¹, Ariane Sigmund¹, Martin Schell¹ (1. Fraunhofer Heinrich-Hertz-Instit. (Germany))

Presentation style: On-site (in-person)

Keywords:Semiconductor Optical Amplifier, Electro-Absorption Modulator , Burried Heterostructure