Yen-Chen Liu¹, Yin-Hung Chen^1,2, Shikha Akshay Joshi³, Chao-Kuang Wen¹, Tung-Han Chuang², *Sheng-Chi Chen^1,4, Chih-Ping Chen¹ (1. Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taipei 243, Taiwan, 2. Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan, 3. Department of Materials Engineering, Indian Institute of Science, Bangalore-560012, India., 4. College of Engineering and Center for Green Technology, Chang Gung University, Taoyuan 333, Taiwan)

*Cheng-Hsun-Tony Chang¹, Yu-Ting Chow², Pei-Cheng Jiang³, Jyh-Shen Tsay⁴ (1. Department of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 2. Department of Electro-Optical Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 3. Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 4. Department of Physics, National Taiwan Normal University, Taipei, Taiwan.)

*Pei-Chen Huang^1,2,3, Ting-Jia Yang², Man-Ying Wang^1,2,3, Jing-Jong Shyue^1,3, Wei-Chun Lin² (1. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan., 2. Department of Photonics, National Sun Yat-sen University, Kaohsiung, Taiwan., 3. Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan.)

*Chih-Yi Liu¹, Chia-Yu Yang¹, Hu-Guan Chiu¹, Dong-Han Du¹, Zhi-Lin Lee¹ (1. National Kaohsiung University of Science and Technology)

*Chin-Chia Kuo¹, Yi-Ting Lin², Wei-Cheng Lien², Chih-Pien Chen¹, Yi-Ting Lai^1,3,4 (1. Department of Materials Engineering, Ming Chi University of Technology, 2. Hyson Technology Inc, 3. Biochemical Technology R&D Center, Ming Chi University of Technology, 4. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology)

*Qixin GUO¹, Koutarou Nonaka¹, Katsuhiko Saito¹, Tooru Tanaka¹ (1. Saga University)

*Akimitsu Hatta¹, Sukma Wahyu Fitriani², Ryota Oshio¹ (1. Kochi University of Technology, 2. Kyushu University)

*Yuejie TAN¹, Shinsuke Miyajima¹ (1. Tokyo Institute of Technology)

*Lin Kuan Chen¹, Lou Bih Show^2,3, Li Chia Lin⁴, Lee Jyh Wei^1,4,5,6 (1. Department of Materials Engineering, Ming Chi University of Technology, New Taipei City, Taiwan, 2. Chemistry Division, Center for General Education, Chang Gung University, Taoyuan, Taiwan, 3. Department of Orthopaedic Surgery, New Taipei Municipal TuCheng Hospital, Chang Gung Memorial Hospital, Taiwan, 4. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei, Taiwan, 5. College of Engineering, Chang Gung University, Taoyuan, Taiwan, 6. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan)

*Jaewon Lim¹ (1. Jeonbuk National University)

*Shun Fujihara¹, Hiroshi Toyota¹ (1. Hiroshima Institute of Technology)

*Junichi Yanagisawa¹, Ruiji Shigesada¹, Masayoshi Ichimiya¹, Takahiko Ban¹, Atsushi Kinomura² (1. The University of Shiga Prefecture, 2. Kyoto University)

*Junpei Kidokoro¹, Peng Yu¹, Kunio Okimura¹, Md. Suruzu Mian², Toshihiro Nakanishi³ (1. Graduate School of Engineering, Tokai University, 2. Faculty of Science and Technology, Seikei University, 3. Department of Electronic Science and Engineering, Kyoto University)

*Peng Yu¹, Junpei Kidokoro¹, Kunio Okimura¹, Md. Suruz Mian², Yosuke Nakata³ (1. Graduate School of Engineering, Tokai University, 2. Faculty of Science and Technology, Seikei University, 3. Graduate School of Engineering Science, Osaka University)

*Anjali ¹, Weon Cheol Lim², Aditya Sharma³, Moditma¹, Sangsul LEE^4,5, H J Shin⁶, Keun Hwa Chae², Jitendra Pal Singh¹ (1. Department of Sciences (Physics), Manav Rachna University、2. Advanced Analysis and Data Center, Korea Institute of Science and Technology、3. Department of Physics, University of Petroleum and Energy Studies、4. Pohang Accelerator Laboratory、5. Department of Semiconductor Engineering、6. Department of Physics, Chungbuk National University)

*Chia-Lin Li¹, Sen-You Hou², Jyh-Wei Lee^1,3,4,5, Po-Yu Chen² (1. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, 2. Department of Materials Science and Engineering, National Tsing Hua University, 3. Department of Materials Engineering, Ming Chi University of Technology, 4. College of Engineering, Chang Gung University, 5. High Entropy Materials Center, National Tsing Hua University)

*Yosuke Abe¹, Takahito Nishimura¹, Akira Yamada¹ (1. Tokyo Institute of Technology)

*Wei-Jie Wang¹, Jinn P Chu¹ (1. National Taiwan University of Science and Technology)

*Ryo Taguchi¹, Kazuki Tajima¹, Hiroshi Watanabe¹, Takashi Kubota¹, Haruhisa Akiyama¹ (1. National Institute of Advanced Science and Technology)

*Taisei Motomura¹, Kenshin Takemura¹, Toshimi Nagase¹, Nobutomo Morita¹, Wataru Iwasaki¹, Naoki Matsuda¹, Tatsuo Tabaru¹ (1. AIST)

Itsuki Misono¹, *Taisei Motomura², Masato Uehara², Tatsuo Tabaru², Tetsuya Okuyama^1,3 (1. NIT, Kurume College, 2. AIST, 3. Kyushu Univ.)

*Pei-Cheng Jiang¹, Yu-Ting Chow², Cheng-Hsun-Tony Chang³ (1. Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan., 2. Department of Semiconductor and Electro-Optical Technology, Minghsin University of Science and Technology, Hsinchu, Taiwan., 3. Department of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan.)

*Ryota Narishige¹, Naoto Yamashita¹, Kunihiro Kamataki¹, Takamasa Okumura¹, Kazunori Koga¹, Masaharu Shiratani¹, Naho Itagaki¹ (1. Kyushu University)

*Takafumi Yunoue¹, Takamasa Usami², Michihiro Yamada², Kotaro Yataka¹, Hiroki Otsuyama¹, Naoto Yamashita¹, Kohei Hamaya², Naho Itagaki¹ (1. Kyushu University, 2. Osaka University)

*Mirano Oneda¹, Jumpei Kito¹, Seiya Watanabe¹, Genki Sano¹, Takahiro Bando¹, Hirofumi Takikawa¹, Hiroaki Sugita², Takahiro Hattori², Hiroki Gima² (1. Toyohashi University of Technology, 2. OSG Co., Ltd., Research & Development Center)

*Kira Magali Franco Davalos¹, Alejandro Jesus Gorostiaga Tippach¹, Bruno Nicolás Sánchez Acosta ¹, Clara Celia Thielmann¹, Feng-Li Tea², Yu-Lin Kuo² (1. Taiwan-Paraguay Polytechnic University , 2. Department of Mechanical Engineering National Taiwan University of Science and Technology )

*Kosei Kikuchi¹, Keiichi Takizawa¹, Kanta Mori¹, Robert Boyd², Sebastian Ekeroth², Ulf Helmersson², Nikolay Britun³, Tetsuhide Shimizu¹ (1. Tokyo Metropolitan University, 2. Linköping University, 3. Nagoya University)

*Yamato Yokoyama¹, Midori Kawamura¹, Kazuhisa Suzuki¹, Takayuki Kiba¹ (1. Kitami institute of technology)

*Pei-Chen Huang^1,2,3, Ting-Jia Yang², Man-Ying Wang^1,2,3, Jing-Jong Shyue^1,3, Wei-Chun Lin² (1. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan., 2. Department of Photonics, National Sun Yat-sen University, Kaohsiung, Taiwan., 3. Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan.)

*Jian-Rong Chen¹, Peng Kun Cheng¹ (1. Ming Chi University of Technology)

*Akihiro Shimizu^1,2, Kazuhiro Fukada³, Shinichi Endo¹, Shoko Kobayashi⁴, Koichi Higashimine⁴ (1. Ushio Inc., 2. Gifu University, 3. Shibaura Machine Co., Ltd., 4. Japan Advanced Institute of Science and Technology)

*Beng Kang TAY¹ (1. Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University)

Yu Jie Chen¹, Chia Feng Hsieh², *Shu-Chuan Liao^1,2 (1. Tamkang University, 2. DaYeh University)