ISSP2024

Session information

Oral Presentation

2.Sputtering and Plasma Process Technologies

Oral Session SP2

Fri. Jul 5, 2024 2:50 PM - 4:40 PM Room O (Science Hall)

3:40 PM - 4:00 PM

Cheng-Hao Tsai1, Teng-Ping Chu2,3, Min-Chen Chuang2,3, Jyh-Wei Lee1,2,4, *Sheng-Chi Chen1,2,4, Phuoc Huu Le2,3, Hui Sun5 (1. Department of Materials Engineering, Ming Chi University of Technology, New Taipei City 243303, Taiwan, 2. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei City 243303, Taiwan, 3. International Ph.D. Program in Plasma and Thin Film Technology, Ming Chi University of Technology, New Taipei City 243303, Taiwan, 4. College of Engineering and Center for Green Technology, Chang Gung University, Taoyuan 333, Taiwan, 5. School of Space Science and Physics, Shandong University, Weihai 264209, China)

4:00 PM - 4:20 PM

*Yuji Oshida1, Thomas Nelis2,3, Caroline Hain2,3, Tetsuhide Shimizu1 (1. Tokyo Metropolitan University, 2. Institute for Applied Laser, Photonics and Surface Technologies, BFH, Bern University of Applied Sciences, Quellgasse 21, 2502 Biel/Bienne, Switzerland, 3. Laboratory for Mechanics of Materials and Nanostructures, Empa, Swiss Federal Laboratories for Materials Science and Technology, Feuerwerkerstrasse 39, 3602 Thun, Switzerland)

×

Authentication

Abstract password authentication.
Password is required to view the abstract. Please enter a password to authenticate.

×

Please log in with your participant account.
» Participant Log In