Poster Session P3

[P3-32] Analysis of adhesion structure between copper seed layer formed via medium-vacuum sputtering and cycloolefin polymer film

*Akihiro Shimizu^1,2, Kazuhiro Fukada³, Shinichi Endo¹, Shoko Kobayashi⁴, Koichi Higashimine⁴ (1. Ushio Inc., 2. Gifu University, 3. Shibaura Machine Co., Ltd., 4. Japan Advanced Institute of Science and Technology)