*Christian Orgeldinger¹, Armin Seynstahl¹, Tobias Rosnitschek¹, Jorge Ramos-Grez², Max Marian², Stephan Tremmel¹ (1. University of Bayreuth, Engineering Design and CAD (LSCAD), Germany, 2. Pontificia Universidad Católica de Chile, Departamento de Ingeniería Mecánica y Metalúrgica, Chile)

*Gang Wen, Xiangli Wen, Pengpeng Bai, Yonggang Meng, Liran Ma, Yu Tian (Tsinghua University, China)

*Kimberly Ming-Xia Foo, Xingyu Chen, Juntao Yang, Hedong Zhang (Nagoya University, Japan)