Poster session 3

[28-PO-21] Investigation on the Tribological Properties of Al₂O₃-TiC Substrate Grain Size in Magnetic Head Recording Head Lapping Process

*Benjie Locsing Fernandez^1,2, Sukkaneste Tungasmita², Duangamol Tungasmita² (1. Western Digital Storage Technologies (Thailand) Ltd., Thailand, 2. Chulalongkorn University, Thailand)

Keywords:Substrate grain size, Material removal rate, Lapping parameter, Al2O3TiC substrate, Magnetic head tribology and machining