IVC-22

Presentation information

Parallel Sessions

Plasma Science and Technologies

[Tue-H2] Plasma Science and Technologies

Tue. Sep 13, 2022 3:00 PM - 4:45 PM Room H (Meeting Room 204)

3:30 PM - 3:45 PM

[Tue-H2-2] Atomic Layer Etching of Si by fluorine radicals with Ar plasmas - Molecular Dynamics Simulation Study

Erin Joy Capdos Tinacba1, *Satoshi Hamaguchi1 (1. Osaka University (Japan))

Keywords:atomic layer etching (ALE), molecular dynamics simulation, plasma surface interaction, plasma etching , semiconductor processing

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