*Shigeru Yao¹, Yusuke Hasebe¹, Yuri Kanazawa¹, Makoto Takeda¹, Ryoko Nakano¹, Hiroshi Sekiguchi¹ (1. Fukuoka University)

Mitsuhiro Kamezaki¹, *Peizhi Zhang¹, Kenshiro Otsuki¹, Shan He¹, Gonzalo Aguirre Dominguez¹, Shigeki Sugano¹ (1. Waseda University)

*Takashi Mizoguchi¹, Tsutomu Takahashi¹, Toshiyuki Hashida², Yasubumi Furuya³ (1. Electronics Engineering Department, Technology and R&D Division, Nabtesco Corporation, 2. Fracture and Reliability Research Institute, Tohoku University, 3. Micro system Interation Center, Tohoku University)

*KENYA HIGASHIJIMA¹, Tomonori KATO¹, Kazuki SAKURAGI¹, Takahiro SATO¹, Manabu ONO² (1. Fukuoka Institute of Technology, 2. Tokyo Metropolitan College of Industrial Technology)

*Takahiro shimizu¹, Tetsuhiro Tsukiji¹, Keitaro Hamada¹ (1. Sophia University)

*Yusuke Takei¹, Shota Amemiya¹, Yuki Kakinuma¹, Hiroyuki Maeda², Hideaki Iwase², Mutsuhiro Maeda³, Kazuo Kaneko², Sumitaka Terasaka⁴, Takeharu Shimoohkawa⁴, Kazuyuki Mitsui¹ (1. Tokyo Denki University, 2. Juntendo University, 3. Yamamoto・Maeda Memorial Association Maeda Hospital, 4. Sanyo Metal Industry Co.,Ltd. )